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Intelligent Nvidia AGX Orin 64G Multi Chip Module GPU 2048 Core 275 TOPS

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Intelligent Nvidia AGX Orin 64G Multi Chip Module GPU 2048 Core 275 TOPS

Name: Intelligent Nvidia AGX Orin 64G Multi Chip Module GPU 2048 Core 275 TOPS
Brand: NVIDIA
Price: 1680 USD

Best Intelligent Nvidia AGX Orin 64G Multi Chip Module GPU 2048 Core 275 TOPS wholesale

Brand Name : NVIDIA

Model Number : AGX orin 64G module

Place of Origin : USA

MOQ : 1PCS

Price : USD1680-USD1700/PCS

Payment Terms : L/C, D/A, D/P, T/T

Supply Ability : 20pcs 15-30 work days

Delivery Time : 15-30 work days

Packaging Details : 100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate

NAME : Intelligent Nvidia AGX Orin 64G Multi Chip Module GPU 2048 Core 275 TOPS

Keyword : Intelligent Nvidia AGX Orin 64G Multi Chip Module GPU 2048 Core 275 TOPS

AI Performance : 275 TOPS (INT8)

GPU : 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores

GPU Max Frequency : 1.3 GHz

CPU : 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3

CPU Max Freq : 2.2 GHz

Memory : 64GB 256-bit LPDDR5 204.8GB/s

Storage : 64GB eMMC 5.1

Other I/O : 4x USB 2.0 4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, DMIC & DSPK, GPIOs

Power : 15W - 60W

Mechanical : 100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate

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Intelligent Nvidia AGX Orin 64G Multi Chip Module GPU 2048 Core 275 TOPS

NVIDIA Jetson AGX Orin 64GB Multi Chip Module

275 Sparse | 138 Dense INT8 TOPS | 15W to 60W

NVIDIA Isaac Platform for Robotics

Robots create new efficiencies and improve quality of life through industries such as manufacturing, logistics, healthcare, and service. NVIDIA Isaac™ accelerates the process with enhanced robotics development, simulation, and deployment.

Accelerating and enhancing robotics—from development to simulation to deployment.

From smart automation in manufacturing to last-mile delivery, robots are becoming more ubiquitous in everyday life. However, industrial and commercial robotics development can be complex, time consuming, immensely challenging, and expensive. Unstructured environments across many use cases and scenarios are also common. The NVIDIA Isaac™ robotics platform addresses these challenges with an end-to-end solution to help decrease costs, simplify development, and accelerate time to market.

NVIDIA Jetson AGX Orin 64GB Module Technical Specifications

Module	NVIDIA Jetson AGX Orin 64GB
AI Performance	275 TOPS
GPU	2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores
GPU Max Frequency	1.3 GHz
CPU	12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3
CPU Max Frequency	2.2 GHz
DL Accelerator	2x NVDLA v2
DLA Max Frequency	1.6 GHz
Vision Accelerator	1x PVA v2
Memory	64GB 256-bit LPDDR5 204.8GB/s
Storage	64GB eMMC 5.1
Camera	Up to 6 cameras (16 via virtual channels) 16 lanes MIPI CSI-2 D-PHY 2.1 (up to 40Gbps) \| C-PHY 2.0 (up to 164Gbps)
Video Encode	2x 4K60 (H.265) 4x 4K30 (H.265) 8x 1080p60 (H.265) 16x 1080p30 (H.265)
Video Decode	1x 8K30 (H.265) 3x 4K60 (H.265) 7x 4K30 (H.265) 11x 1080p60 (H.265) 22x 1080p30 (H.265)
PCIe	Up to 2 x8 + 1 x4 + 2 x1 (PCIe Gen4, Root Port, & Endpoint)
Networking	1x GbE 1x 10GbE
Power	15W - 60W
Mechanical	100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate

Intelligent Nvidia AGX Orin 64G Multi Chip Module GPU 2048 Core 275 TOPS

The end-to-end Isaac robotics platform.

Accelerate the development process with enhanced robotics development, simulation, and deployment.

Intelligent Nvidia AGX Orin 64G Multi Chip Module GPU 2048 Core 275 TOPS

Temperature range (at Thermal Transfer Plate (TTP) surface)	-25 °C to 80 °C
Operating humidity	5% to 85% RH
Storage temperature (Ambient)1	-25 °C to 80 °C
Storage humidity	30% to 70% RH

Note: See the NVIDIA Jetson AGX Orin Design Guide for details on the UPHY configurations supported. MGBE, USB 3.2, and PCIe share UPHY Lane.

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